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A semi-annual multi-client foundry panel at process-node granularity (108 pages): for each advanced node (11/12/14/16nm, 8/10nm, 6/7nm, 4/5nm, 3nm, 2nm, plus legacy from 40/45nm) it carries shipment revenue and capacity trends across CY2023 to CY2026 forecast, capacity allocated by individual foundry AND by named customer for 2025 forecast, wafer shipment volumes broken out by application and by customer, and node-level utilization-rate trends; plus foundry revenue share including tier-2 foundries 2022-2026 forecast, process-node coverage by foundry, process-migration movement by major application, hyperscaler capital-expenditure trends, a back-end substrates and packaging section (covering advanced packaging and chiplet trends), individual company sheets per major foundry, and geopolitical and China-domestic equipment coverage. Memory segments are explicitly excluded, so this is the logic-side capacity book.
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