Supplier census of semiconductor back-end

SEMICONDUCTOR-DIGESTbuyer room · privateManage buyer room

Supplier census of semiconductor back-end (packaging & test) capacity, described in the trade press as the only commercially available OSAT supplier database: 475 facilities across 200+ companies covering both OSATs and (from this edition) integrated device manufacturers. Each site is profiled for location, technology and capability, packaging/test and product specialisations (sensors, automotive, power devices) and specific assembly services offered - BGA, leadframe types (QFP, QFN), small-outline, flip-chip, wafer-level packaging, SiP - plus test capability (325+ sites), leadframe CSP (100+), bumping (80+, 50+ at 300mm), wafer-level CSP (90+) and newly tracked fan-out WLP and fan-out PLP. Carries top-20 OSAT revenue rankings, ownership/shareholder fields and 100+ per-edition capability and ownership updates.