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Two layers. (1) Own order-flow byproduct: PCB/PCBA quote and order records from customer BOM uploads — per part number the demanded quantity, realised component price, sourcing channel and the assembly lead time actually achieved, plus which parts had to be substituted or sourced long because they were allocated or EOL. (2) A monthly-curated component supply-risk series: per-category pressure grades (MLCC, MCU, DRAM/NAND, copper/silver) with dated per-manufacturer price-move and EOL/discontinuation notices, published on a fixed monthly cadence.
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