Project-level tracker of semiconductor construction activity

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Project-level tracker of semiconductor construction activity: 88 active projects (new fabs, advanced-packaging plants and supplier builds) across the US, Europe and Asia-Pacific, each carrying sponsor/developer organisation, region, construction status, disclosed capital investment, CHIPS Act linkage, and a delivery window bounded to 2024-2030. The distinctive second layer is the hiring overlay - the tracker records which disciplines each build is recruiting for (cleanroom, ultra-pure water, controls, MEP, commissioning), a labour-demand signal attached to a physical construction asset that no capex database carries.