Structured techno-geopolitical supply-chain intelligence on the Chinese memory sector, produced as a research byproduct: fab-level wafer input capacity by year (1.62M wafers 2024 rising to 2.73M in 2025), vendor market-share series by product class (about 6% of global DRAM by Q1 2025, projected ~7% DDR5 and ~9% LPDDR5 by late 2025, Chinese-made memory forecast above 10% of combined DRAM plus NAND by Q3 2025), node-roadmap and mass-production milestone dating (first China-developed DRAM in 2019), and a full cap table / investment graph of the target (state-backed ICF, Anhui and Hefei municipal vehicles, Xiaomi, Alibaba, Tencent) reconstructed from Chinese-language registries, local government announcements and trade press.
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